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may 2008 rev 1 1/17 HDMIULC6-2X6 ultra large bandwidth esd protection features 2-line esd protection (at 15 kv air and contact discharge, exceeds iec 61000-4-2) ultra low capacitance: 0.6 pf @ 825 mhz ultra high bandwidth - no influence on signal rise and fall times - maximised number of signal harmonics very low leakage current: 0.5 a max. fast response time compared with varistors protects v bus when applicable rohs compliant benefits esd standards compliance guaranteed at device level, thus greater immunity at system level esd protection of v bus when applicable. high efficiency due to low residual voltage when confronted by an esd surge large bandwidth to minimize impact on data signal quality consistent d+ / d- signal balance: ? ultra low impact on intra- and inter-pair skew ? matching high bit rate hdmi requirements and ready for future evolution low pcb space occupation - 1.45 mm 2 for qfn low leakage current for longer operation of battery powered devices higher reliability offered by monolithic integration 500 m pitch for qfn 6 leads complies with these standards iec 61000-4-2 level 4 ? 15 kv air discharge ? 8 kv contact discharge mil std883g-method 3015-7 applications hdmi ports at 1.65 gb/s and up to 3.2 gb/s ieee 1394a, b, or c up to 3.2 gb/s usb 2.0 ports up to 480 mb/s (hi-speed) ethernet port: 10/100/1000 mb/s video line protection description the HDMIULC6-2X6 is a monolithic, application specific discrete device dedicated to esd protection of the hdmi connection. it also offers the same high level of protection for ieee 1394a and ieee 1394b/c, usb 2.0, ethernet links, and video lines. its ultra high cutoff frequency (5.9 ghz) secures a high level of signal integrity. the device topology provides this integrity without compromising the complete protection of ics against the most stringent esd strikes. qfn (pin view) hdmiulc6-2m6 sot-666 hdmiulc6-2p6 www.st.com
characteristics HDMIULC6-2X6 2/17 1 characteristics figure 1. functional diagram table 1. absolute ratings symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 air discharge iec 61000-4-2 contact discharge mil std883g-method 3015-7 15 15 25 kv t stg storage temperature range -55 to +150 c t j maximum junction temperature 125 c t l lead solder temperature (10 seconds duration) 260 c table 2. electrical characteristics (t amb = 25 c) symbol parameter test conditions value unit min. typ. max i rm leakage current v rm = 5 v 0.5 a v br breakdown voltage between v bus and gnd i r = 1 ma 6 v v cl clamping voltage i pp = 1 a, t p = 8/20 s any i/o pin to gnd 12 v i pp = 5 a, t p = 8/20 s any i/o pin to gnd 17 v c i/o-gnd capacitance between i/o and gnd v r = 0 v, f = 825 mhz 0.85 pf c i/o-gnd capacitance variation between i/o and gnd v r = 0 v, f = 1 mhz 0.02 pf c i/o-i/o capacitance between i/o v r = 0 v, f = 825 mhz 0.5 pf 1 6 2 5 3 4 i/o1 i/o1 gnd v bus i/o2 i/o2 1 16 2 5 3 4 i/o1 i/o1 gnd v bus i/o2 i/o2 qfn 6 leads sot666 when used with a hdmi application, pin 5 should not be connected to protect against backdrive current flow on data lines.
HDMIULC6-2X6 characteristics 3/17 figure 2. line capacitance versus line voltage (typical values) figure 3. line capacitance versus frequency (typical values) hdmiulc6-2m6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 f=825mhz v osc = 500mv rms v bus open t j =25 c 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 data line voltage (v) c i/o - gnd c(pf) 0 v osc =30mv rms t j =25 c v i-o/gnd = 0v f(mhz) 1 10 100 1000 10000 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 c(pf) c i/o - gnd c i/o -c i/o v open bus figure 4. line capacitance versus frequency (typical values) hdmiulc6-2p6 figure 5. frequency response (typical values) hdmiulc6-2m6 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 10 100 1000 10000 vosc=30mvrms t j = 25 c v i-o/gnd = 0v v bus open c i/o - gnd c i/o ? i/o f(mhz) c(pf) s21(db) 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g - 16.00 - 12.00 - 8.00 - 4.00 0.00 fc=5.9ghz f(hz) figure 6. frequency response (typical values) hdmiulc6-2p6 figure 7. relative variation of leakage current versus junction temperature (typical values) 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g - 16.00 - 12.00 - 8.00 - 4.00 0.00 ligne 2 s21(db) fc f(hz) =5.3ghz 1 2 3 4 5 25 50 75 100 125 i[t rm j ] / i [t rm j =25c] t (c) j
characteristics HDMIULC6-2X6 4/17 figure 8. eye diagram at 1.65 gbps amplitude 500 mv pcb + hdmiulc6-2m6 figure 9. eye diagram at 3.2 gbps amplitude 500 mv pcb + hdmiulc6-2m6 horizontal: 100 ps/div vertical: 200 mv/div horizontal: 50 ps/div vertical: 200 mv/div figure 10. eye diagram at 1.65 gbps amplitude 500 mv pcb + hdmiulc6-2p6 figure 11. eye diagram at 3.2 gbps amplitude 500 mv pcb + hdmiulc6-2p6 horizontal: 100 ps/div vertical: 200 mv/div horizontal: 50 ps/div vertical: 200 mv/div
HDMIULC6-2X6 application examples 5/17 2 application examples figure 12. hdmi single link application figure 13. t1/e1/ethernet protection tmds links tc+ tc- tx2+ tx2- tx1+ tx1- tx0+ tx0- tmds transmitter video audio ctrl / status video audio ctrl / status multimedia controller controller rx0- rx0+ tmds receiver rx1- rx1+ rx2- rx2+ rc- rc+ display (tv, flat panel, monitor, projector) host (set top box, dvd player, pc) scl cec cec scl control links sda sda hpd hpd hdmi connectors vcc 5v vcc 5v hdmiulc6-2p6 hdmiulc6-4sc6 or usblc6-4sc6 hdmi tmds links tc+ tc- tx2+ tx2- tx1+ tx1- tx0+ tx0- tmds transmitter video audio ctrl / status video audio ctrl / status multimedia controller controller rx0- rx0+ tmds receiver rx1- rx1+ rx2- rx2+ rc- rc+ display (tv, flat panel, monitor, projector) host (set top box, dvd player, pc) scl cec cec scl control links sda sda hpd hpd hdmi connectors vcc 5v vcc 5v hdmiulc6-2m6 hdmiulc6-4sc6 hdmi 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 data transceiver smp75-8 smp75-8 tx rx +v cc +v cc 100nf 100nf
application examples HDMIULC6-2X6 6/17 2.1 pcb layout considerations figure 14. pcb layout example figure 15. tdr results for hdmiulc6-2m6 with pcb layout example width=215 m space=100 m z diff=100 0 width=100 m space=400 m 3160 3160 all dimensions in m pcb characteristics substrate: h = 730 m, er =3.9 tracks: h = 35 m copper coatinbg: h = 35 m above substrate: h = 10 m above tracks, er = 3.4 gnd plane on the bottom layer
HDMIULC6-2X6 technical information 7/17 3 technical information 3.1 surge protection the HDMIULC6-2X6 is particularly optimized to perform esd surge protection based on the rail to rail topology. the clamping voltage v cl can be calculated as follows: with: v f = v t + r d .i p (v f forward drop voltage) / (v t forward drop threshold voltage) and v transil = v br + r d_transil . i p calculation example we assume that the value of the dynamic resistance of the clamping diode is typically: r d = 0.5 and v t = 1.1 v. we assume that the value of the dynamic resistance of the transil diode is typically r d_transil = 0.5 and v br = 6.1 v for an iec 61000-4-2 surge level 4 (contact discharge: v g = 8 kv, r g = 330 ), v bus = +5 v, and, in first approximation, we assume that: i p = v g / r g = 24 a. we find: note: the calculations do not take into account phenomena due to parasitic inductances. 3.2 surge protection application example if we consider that the connections from the pin v bus to v cc , from i/o to data line, and from gnd to pcb gnd plane are two tracks 10 mm long and 0.5 mm wide, we can assume that the parasitic inductances, l vbus , l i/o , and l gnd , of these tracks are about 6 nh. so when an iec 61000-4-2 surge occurs on the data line, due to the rise time of this spike (tr = 1 ns), the voltage v cl has an extra value equal to l i/o .di/dt + l gnd .di/dt. the di/dt is calculated as: di/dt = ip/tr = 24 a/ns for an iec 61000-4-2 surge level 4 (contact discharge v g = 8 kv, r g = 330 ) the over voltage due to the parasitic inductances is: l i/o .di/dt = l gnd .di/dt = 6 x 24 = 144 v by taking into account the effect of these parasitic inductances due to unsuitable layout, the clamping voltage will be: we can reduce as much as possible these phenomena with simple layout optimization. v cl + = v transil + v f for positive surges v cl - = - v f for negative surges v cl + = +31.2 v v cl - = -13.1 v v cl + = +31.2 + 144 +144 = 319.2 v v cl - = -13.1 - 144 -144 = -301.1 v
technical information HDMIULC6-2X6 8/17 figure 16. esd behavior: parasitic phenomena due to unsuitable layout figure 17. esd behavior - measurement conditions figure 18. remaining voltage after the hdmiulc6-2m6 during positive esd surge figure 19. remaining voltage after the hdmiulc6-2m6 during negative esd surge v bus data line v cl l vbus l i/o l gnd v transil esd surge on data line v f dt di l i/o dt di l i/o dt di l gnd dt di l gnd v cc pin i/o pin gnd pin v bus data line v cl l vbus l i/o l gnd v transil esd surge on data line v f dt di l i/o dt di l i/o dt di l gnd dt di l gnd v cc pin i/o pin gnd pin 0 surge dt di l dt di l v v 0 surge dt di l dt di l v v v gnd i/o f cl gnd i/o f transil cl < - - - = > + + + = - + tr=1ns t v cl- negative surge dt di l dt di l gnd i/o - - dt di l dt di l gnd i/o - - -v f tr=1ns t v cl- negative surge dt di l dt di l gnd i/o - - dt di l dt di l gnd i/o - - -v f v transil +v f tr=1ns t v cl+ dt di l dt di l gnd i/o + positive surge tr=1ns t v cl+ dt di l dt di l gnd i/o + dt di l dt di l gnd i/o + positive surge v transil +v f tr=1ns t v cl+ dt di l dt di l gnd i/o + dt di l dt di l gnd i/o + positive surge tr=1ns t v cl+ dt di l dt di l gnd i/o + dt di l dt di l gnd i/o + positive surge rd.ip v v br transil + = test board in out test board in out esd surge 10v/div 100ns/div 10v/div 100ns/div
HDMIULC6-2X6 technical information 9/17 important an important precaution to take is to put the protection device as close as possible to the disturbance source (generally the connector). 3.3 crosstalk behavior figure 22. crosstalk phenomena the crosstalk phenomena is due to the coupling between 2 lines. the coupling factor ( 12 or 21 ) increases when the gap acro ss lines decreases, particularly in silicon dice. in the example above the expected signal on load r l2 is 2 v g2 , in fact the real voltage at this point has got an extra value 21 v g1 . this part of the v g1 signal represents the effect of the crosstalk phenomenon of the line 1 on the line 2. this phenomenon has to be taken into account when the drivers impose fast digital data or high frequency analog signals in the disturbing line. the perturbed line will be more affected if it wo rks with low voltage signal or high load impedance (few k ). figure 20. remaining voltage after the hdmiulc6-2p6 during positive esd surge figure 21. remaining voltage after the hdmiulc6-2p6 during negative esd surge 10v/div 100ns/div 10v/div 100ns/div line 1 line 2 v g1 v g2 r g1 r g2 drivers r l1 r l2 receivers + 1 12 v g1 v g2 + 2 21 v g2 v g1
technical information HDMIULC6-2X6 10/17 figure 23. analog crosstalk measurements figure 23 gives the measurement circuit for the anal og application. in usual frequency range of analog signals (up to 240 mhz) the effect on disturbed line is less than -40 db (see figure 24 and figure 25 ). figure 24. analog crosstalk results (typical values) for hdmiulc6-2m6 figure 25. analog crosstalk results (typical values) for hdmiulc6-2p6 network analyser port 2 network analyser port 1 test board network analyser port 2 network analyser port 1 test board db 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g - 120.00 - 90.00 - 60.00 - 30.00 0.00 f (hz) -7.6db@7ghz 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g - 120.00 - 90.00 - 60.00 - 30.00 0.00 db 7.2db@7ghz f (hz)
HDMIULC6-2X6 recommendation on pcb assembly 11/17 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness) figure 26. stencil opening dimensions. b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 27. recommended stencil window position (qfn only) l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 250 m 650 m 620 m 236 m 15 m 15 m 7m 7m footprint stencil window footprint
recommendation on pcb assembly HDMIULC6-2X6 12/17 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
HDMIULC6-2X6 recommendation on pcb assembly 13/17 4.5 reflow profile figure 28. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
package information HDMIULC6-2X6 14/17 5 package information epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com . figure 29. qfn 6 leads footprint dimensions in mm [inches] note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. micro qfn 1.45x1.00 6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.45 0.057 e 1.00 0.039 e 0.50 0.020 k 0.20 0.008 l 0.30 0.35 0.40 0.012 0.014 0.016 e d a a1 e b k l n 1 1 2 2 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 [0.012] 1.60 [0.063]
HDMIULC6-2X6 package information 15/17 figure 30. footprint (dimensions in mm) table 4. sot-666 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.60 0.018 0.024 a3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 d 1.50 1.70 0.059 0.067 e 1.50 1.70 0.059 0.067 e1 1.10 1.30 0.043 0.051 e0.50 0.020 l1 0.19 0.007 l2 0.10 0.30 0.004 0.012 l3 0.10 0.004 d b l3 l1 e b1 e1 l2 e a a3 0.50 2.60 0.62 0.30 0.99
ordering information HDMIULC6-2X6 16/17 6 ordering information 7 revision history table 5. ordering information order code marking package weight base qty delivery mode hdmiulc6-2m6 t (1) 1. the marking can be rotated by 90 to diferentiate assembly location qfn 6 leads 2.2 mg 3000 tape and reel hdmiulc6-2p6 r sot-666 2.9 mg 3000 tape and reel table 6. document revision history date revision description of changes 06-may-2008 1 first issue.
HDMIULC6-2X6 17/17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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